Are you looking for a fully funded fellowship program to pursue your PhD studies? Look no further as the Hong Kong Research Grants Council (RGC) is set to offer a lucrative scholarship opportunity through their Hongkong PhD Fellowship Scheme (HKPFS) 2024-2025.
The HKPFS program is a fully funded fellowship covering tuition fees, travel expenses, and providing free hostel accommodations, as well as access to international conferences. This makes it an attractive option for international students looking to further their studies in social sciences, medicine, sciences, humanities, engineering & technology, and business studies.
To be eligible for this scholarship, international students must have completed an undergraduate degree with high marks and have obtained IELTS or TOEFL certifications. If you’re considering applying, now is the time to start preparing for these language exams.
The Hongkong Universities participating in the HKPFS fellowship program include Lingnan University, Hong Kong University of Science and Technology, Hong Kong Polytechnic University, Education University of Hong Kong, City University of Hong Kong, Chinese University of Hong Kong, University of Hong Kong, and Hong Kong Baptist University.
The application process for the HKPFS scholarship is entirely online. Applicants will need to submit separate applications on the HKPFS HKPFSES webpage and on their chosen Hongkong University’s admission portal. It’s also possible to apply for two subject options and select two universities to maximize your chances of selection.
For those seeking an edge in the selection process, reaching out to professors at the preferred Hongkong Universities and inquiring about vacancies for PhD students in their departments can significantly improve your chances of acceptance.
The HKPFS fellowship offers a unique opportunity for international students to pursue their PhD studies in Hong Kong. You won’t want to miss out on this exciting opportunity, so start preparing now and mark your calendars for the opening of the application window in September 2023.
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